What Files Do You Need to Send a PCB for Fabrication?
Last updated 25 June 2026 · 3 min read
Direct Answer
A PCB fabrication package typically includes Gerber files (one per copper, mask, and silkscreen layer), an NC drill file, a stack-up/layer-order drawing, and — for assembly — a pick-and-place file and bill of materials, together fully describing the board's geometry, layers, and components to a fab and assembly house.
Detailed Explanation
A complete fabrication package needs to describe the board fully enough that a fab house with no other context can build exactly what was designed. At minimum that means: Gerber files (one per copper layer, solder mask layer, and silkscreen layer), an NC drill file (hole positions and sizes), and a document specifying the stack-up — layer order, copper weight, and dielectric — since Gerber files alone don't inherently convey how layers stack vertically.
For assembly, two more files matter: a pick-and-place (centroid) file giving each component's position, rotation, and reference designator, and a bill of materials (BOM) listing every part, its footprint, and ideally a manufacturer part number. Without both, an assembly house has the bare board and a schematic but no machine-readable instructions for where each component actually goes.
For KiCad users, the complete export workflow — Gerber plot layer selection, drill file generation, coordinate origin alignment, and pre-submission verification in GerbView — is covered in How to Export Gerber Files from KiCad for PCB Fabrication.
Practical Examples
A two-layer board with simple through-hole and SMT parts can typically ship with just Gerbers, a drill file, and a basic stack-up note (it's usually obvious from "2 layers, standard 1.6 mm FR4") — the fab house has little ambiguity to resolve.
A four-layer board with controlled-impedance traces needs its stack-up specified explicitly and unambiguously, because the fab house's actual dielectric thickness and copper weight directly determine whether the delivered board meets the impedance target the design assumed — a vague or missing stack-up drawing here isn't just an inconvenience, it can silently change the board's electrical behaviour.
Design Considerations
- Always include an explicit stack-up drawing for anything beyond a basic two-layer board — don't rely on the fab house guessing layer order or copper weight correctly.
- Generate the BOM and pick-and-place file directly from the same design database as the Gerbers, not a hand-maintained spreadsheet — manual BOMs drift out of sync with the actual layout far more often than generated ones.
- Confirm units and format conventions with your specific fab house before sending files — Gerber format variants and unit conventions (metric vs imperial) have historically been a source of silent misinterpretation.
- Run a final design rule check immediately before generating output files, not before some unrelated later change — output should always reflect the layout's final, DRC-clean state.
- End-to-end fabrication support: If you're navigating a first board submission or a new fab house relationship, a rapid prototyping partner can manage the output package, submission, and first-article review on your behalf.
Common Mistakes
- Sending Gerber files without a stack-up drawing and assuming the fab house will infer the correct layer order and copper weight.
- Maintaining the BOM by hand in a separate spreadsheet instead of generating it from the design database, leading to mismatches between what's documented and what's actually on the board.
- Generating output files before the final DRC pass, then having to regenerate everything after a late layout fix.
- Assuming every fab house interprets Gerber conventions (units, layer naming, aperture format) identically — confirming this in advance avoids a misfabricated first article.
Frequently Asked Questions
- What's the difference between Gerber and a single combined format like ODB++ or IPC-2581?
- Gerber describes one layer per file with no built-in relationship between them, so the fab house infers stack-up order from a separate drawing or naming convention. ODB++ and IPC-2581 are combined, intelligent formats that bundle every layer, drill data, and stack-up information into a single file with explicit layer relationships, reducing the chance of a fab house misinterpreting layer order — most fab houses still accept Gerber, but combined formats are increasingly preferred for complex boards.
- Do I need to provide a pick-and-place file if I'm hand-assembling the board myself?
- Not for the fab house, but it's still useful for yourself or anyone hand-assembling the board — a pick-and-place file (with component reference, position, and rotation) doubles as an assembly reference even without automated placement equipment, and most EDA tools generate it for free alongside the fabrication files.
References
Related Questions
What Are PCB Design Rules (DRC), and Why Do They Matter?
PCB design rules define the manufacturability and electrical constraints a layout must meet. DRC is the automated check that verifies them before fabrication.
PCB Design for Manufacturability (DFM): What It Means
PCB design for manufacturability (DFM) matches a layout to a fab and assembly house's real process capability, preventing costly late-stage respins.
What Is a PCB Stack-Up, and How Do You Design One?
A PCB stack-up is the arrangement of copper and dielectric layers in a board. Here's how layer count and plane assignment shape a stack-up design.
PCB Footprint vs Schematic Symbol: What is the Difference?
A schematic symbol is a component's logical representation; a PCB footprint is its physical land pattern. Here's how the two relate and differ.
How to Use KiCad: Schematic Entry and PCB Layout Workflow
A practical guide to the KiCad PCB design workflow — schematic entry, ERC, footprint assignment, PCB layout, routing, DRC, and Gerber output.
How to Export Gerber Files from KiCad for PCB Fabrication
How to export Gerbers, drill files, and assembly data from KiCad 8 — layer selection, coordinate origin, and Gerber verification before fab submission.
Related Forum Discussions
Got boards back from my first CM assembly run — tombstoning on 0402s and QFN bridging
Finally bit the bullet and sent my first board to a CM for assembly rather than hand-soldering everything. Got the boards back yesterday and
Is a double-sided PCB enough for a simple ESP32 sensor board, or should I go multi-layer?
Building a little battery-powered sensor board around an ESP32 module (the kind with the PCB antenna already built into the module, not desi
Decoupling caps placed right next to the IC but still seeing power rail noise
Fast digital board, MCU running a few hundred MHz core clock plus a couple of high-speed peripherals. Put 100 nF caps right next to every po
Best 4-layer stack-up for a board with both analog and digital circuitry?
Spinning up a board with an STM32 doing the digital side and a precision analog front end (instrumentation amp into an ADC) reading a low-le